Impact of Solder Interconnect Configuration Modeling on Reliability Assessment Results of Electronic AssembliesAuthors: Jingsong Xie, Ph.D.
Company: RelEng Technologies, Inc.
Date Published: 9/28/2014 Conference: SMTA International
In this study, geometrical factors that are of particular interests for automation in FEA modeling are first identified from those that have been reported significant to accuracy of assessment results in previous studies. This study focuses on understanding the impact of the factors across an assembly board of this investigation. This information will help with follow-up effort of model simplification and component model library creation. These geometries include different geometric shapes of both array type solder balls and gull-wing type SMT solder joints. Discussions also involve the impact of some typical local assembly configuration features such as solder areas, copper pads and solder masks on stress analysis results.
solder interconnect, reliability assessment, electronic assembly, geometrical factor, automation process of simulation and analysis
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