The Effect of Pcb and System Thermal Efficiency on The Thermal Performance of Die Attach Materials
Authors: Mohammed Mansi, Daryl Santos, Ross Havens, Krishnaswami Srihari, Bruce Fried and Julia Zhao Company: State University of New York at Binghamton and Analog Devices, Inc. Date Published: 9/28/2014
Abstract: The use of a die attach material as a solution to improve the thermal performance of electronics packages is investigated. A study was conducted using two different die attach materials with different PCB designs. The two die attach materials have differing thermal conductivities of 1.6 W/m.k and 50.0 W/m.k, respectively. Different PCB designs include 5x5 and 8x8 via arrays (0.25 mm diameter and 1.20 mm pitch) and the use of copper slug in the PCB. The results showed that with the increase of the system’s and PCB’s thermal efficiencies, more improvement is gained from using the die attach material with higher thermal conductivity, as might be expected. However, using the material with higher thermal conductivity with a thermally inefficient PCB will not show significant thermal improvement as compared to the former.