SMTA International Conference Proceedings

Understanding Nano-Sized Fillers in Conductive Adhesives

Authors: Herbert J. Neuhaus, Ph.D. and Charles E. Bauer, Ph.D.
Company: TechLead Corporation
Date Published: 9/28/2014   Conference: SMTA International

Abstract: Conductive adhesives based on nano-technology exhibit remarkable properties and, hyperbole aside, likely form a new foundation for electronics assembly. However, the use of nano-materials involves multiple challenges including high cost, potential toxicity, and often unstable dispersions of the nano-material within the adhesive. A detailed and quantitative model of how nano-fillers modify the properties of conductive adhesives would guide both material and process development efforts. After a brief review of literature, this paper outlines various strategies employed in formulating adhesives emphasizing the trade-offs present in the incorporation of nano-sized fillers. An understanding of the role and contribution of nano-sized fillers reveals that the extraordinary reactivity of nano-materials can substantially increase the conductivity of conventional fillers even at very low loadings.

Key Words: 

Adhesives, electrical conductive, nanotechnology, fillers, conductive, model, conduction

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