Embedding of Power Semiconductors for Innovative Packages and ModulesAuthors: Lars Boettcher, Stefan Karaszkiewicz, Dionysios Manessis, and Andreas Ostmann
Company: Fraunhofer Institute for Reliability and Microintegration (IZM) and Technical University of Berlin
Date Published: 9/28/2014 Conference: SMTA International
A new approach for embedded power modules will be presented, which can cover different application fields, ranging from 50 W over 500 W to 50kW power modules for different applications like single chip packages, over power control units for pedelec (Pedal Electric Cycle), to inverter modules for automotive applications. This approach will focus on a power core base structure for with embedded semiconductors, which is then connected to a high power PCB. The connection to the embedded die is realized by a direct copper connection only. The technology principle will be described in detail.
The embedding of chips offers a solution for many of the problems in power chip packages and power modules. While chip embedding was an academic exercise a decade ago, it is now an industrial solution . A huge advantage of packaging using PCB technology is the cost-effective processing on large panel. Furthermore embedded packages and modules allow either double-side cooling or 3D assembly of components like capacitors, gate drivers or controllers.
Power semiconductor packaging, embedded components, embedded actives and passives, PCB technology, System in Package, power electronics
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