SMTA International Conference Proceedings

Embedded Passive Technology Materials, Design and Process

Author: Hikmat Chammas
Company: Honeywell International
Date Published: 9/28/2014   Conference: SMTA International

Abstract: Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk. This paper summarizes the selection of resistor embedded materials, evaluations of resistive material (Phase 1) and duplication of a complex digital design (Phase 2). Phase 1 – Ticer’s TCR® resistive materials (Foil 25O/sq NiCr and 1kO/sq CrSiO) and Ohmega resistive-Ply materials (Ohmega-Ply 25O/sq and 250O/sq NiP) were chosen for evaluation.

Phase 2 – Due to the high level of complexity and advance materials dielectric, the Digital Imaging Processor unit was chosen as an evaluation vehicle. Process Evaluation for embedded was used to determine present process gaps for laser trimming, fabrication material, raw board test and defining specifications for DFM and layout design.

Key Words: 

Embedded Resistors, Embedded capasitor, Materials Dielectric properties, Printed Wire Circuit, CCA Design and evaluation vehicle design

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