Embedded Passive Technology Materials, Design and ProcessAuthor: Hikmat Chammas
Company: Honeywell International
Date Published: 9/28/2014 Conference: SMTA International
Phase 2 – Due to the high level of complexity and advance materials dielectric, the Digital Imaging Processor unit was chosen as an evaluation vehicle. Process Evaluation for embedded was used to determine present process gaps for laser trimming, fabrication material, raw board test and defining specifications for DFM and layout design.
Embedded Resistors, Embedded capasitor, Materials Dielectric properties, Printed Wire Circuit, CCA Design and evaluation vehicle design
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