PCB Design and Fabrication Process Variations for Embedding Passive and Active ComponentsAuthor: Vern Solberg
Company: Solberg Technical Consulting
Date Published: 9/28/2014 Conference: SMTA International
This paper will focus on six basic embedded component structure designs described in IPC-7092. The process variations define the structure, depending on whether components are passive or active, placed and/or formed and if they are on one side of the PCB base-core or both.
Embedded components, printed circuit, multilayer, high-density interconnect, HDI
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.