SMTA International Conference Proceedings


PCB Design and Fabrication Process Variations for Embedding Passive and Active Components

Author: Vern Solberg
Company: Solberg Technical Consulting
Date Published: 9/28/2014   Conference: SMTA International


Abstract: Embedding components within the PC board structure is not a new concept, however, until recently, most applications adapted only passive elements. The processes relied on resistive inks and films for the resistor elements and enhanced dielectric layering for capacitors. And although these methods remain viable, many companies have evolved into placing discrete passive and active components within the PC board layering structure. Many have found that by reducing the component population on the PC board’s surface, board level assembly is less complex and the PC board can be made smaller.

This paper will focus on six basic embedded component structure designs described in IPC-7092. The process variations define the structure, depending on whether components are passive or active, placed and/or formed and if they are on one side of the PCB base-core or both.

Key Words: 

Embedded components, printed circuit, multilayer, high-density interconnect, HDI



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