Reliability Evaluation of Ultra Large BGA System-In-Package (SiP) Module AssembliesAuthors: Weidong Xie, Cherif Guirguis, Qiang (Johnson) Wang, and Mudasir Ahmad
Company: Cisco Systems, Inc.
Date Published: 9/28/2014 Conference: SMTA International
In this study, a full scale reliability evaluation of the SiP module assembly has been conducted. The evaluation included 0/100°C Accelerated Temperature Cycling (ATC), mechanical shock under different impulse G levels, and mechanical four-point bend. The test vehicle of this study has been designed to include multiple chains for real time continuity monitoring of interconnects at different levels, i.e. from ASIC flip chip to module substrate, from DDR3 memory components to module substrate, and from SiP module to Print Circuit Board (PCB). Some of those daisy chains were dedicated to the interconnects in high stress regions such as die shadow areas and package corners to allow pinpointing of the failures at the exact locations during the reliability evaluation. Strain gauges were attached onto the PCB during shock and bend testing so that the board level strains at failure could be recorded. Furthermore, an acoustic emission system has also been adopted during 4-point bend testing to study the onset of pad cratering. Finite element analysis has also been performed to evaluate the stress and strain distributions of the solder joint interconnect structure during shock and bend testing. The insightful results of this study are valuable to design robust and reliable ultra large BGA module assemblies.
solder joint reliability, lead free, assembly, system-in-package, MCM module
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