Effect of Isothermal Preconditioning on Thermal Fatigue Life and Microstructure of a SAC305 BGAAuthors: Jim Wilcox, Richard Coyle, Lawrence Lehman, Joe Smetana
Company: HDP User Group International, Alcatel-Lucent, Binghamton University
Date Published: 9/28/2014 Conference: SMTA International
This paper presents the effect of isothermal precondition aging on the thermal cycle fatigue life of a fine pitch (0.5 mm) BGA component measured in accelerated temperature cycling (ATC). The experiment includes a comparison of the fatigue performance of SAC305 joints with 0, 10, and 20 day preconditioning at 125°C. Temperature cycling was done with a 0 to 100°C temperature range and dwell times of 10 or 60 minutes. Failure data are reported as characteristic life η (N63.2) cycles and slope ß from two-parameter Weibull distribution fits. The ATC data and failure analysis are discussed in terms of the effect of isothermal aging on microstructural evolution prior to cycling as well as during subsequent temperature cycling.
SnAgCu solder, Accelerated Thermal Cycling, Aging, Thermal preconditioning, Dwell time
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