Package on Package Module Assembly Process DevelopmentAuthors: Chuan Xia, Charles Gui and Scott Priore
Company: Cisco Systems, Inc.
Date Published: 9/28/2014 Conference: SMTA International
All fine pitch components are assembled on the module and interconnected to the main board via BGA interface on the bottom of module in order to drive cost down by reducing the HDI interposer size and removing interface connectors. By changing the module top side and mother board designs, we can add more features and have more flexibility for products.
It is not common for board level assembly factory to have capability of solder ball attachment process. Therefore, the work offers great technical challenges on optimizing process material and process parameters. It is also the first time for Cisco to assemble such fine pitch BGAs and develop solder ball attachment process.
This paper describes process material selection, PoP module assembly process development and solder ball attachment process qualification. Detailed DOE and thermal cycle test have been carried out to verify assembly processes.
Package on package (PoP) module, Fine pitch component, Flux dipping process, Solder ball attachment process, High density interconnection (HDI) interposer, Design of experiments (DOE)
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