Ceramic Column Grid Array Design and AssemblyAuthor: J. Scott Nelson
Company: Harris Corporation
Date Published: 9/28/2014 Conference: SMTA International
In order to meet the demands of harsh environments, ruggedization of BGA packages is desired. One such ruggedization technique is the conversion of commercial BGA packages to ceramic column grid array (CCGA) packages. CCGA is an enabling technology that allows high density BGA packages to be used in high performance, high reliability applications. The CCGA package uses a cast or wire column instead of a ball to create a higher standoff and more flexible interconnection. The columns significantly increase solder joint thermal fatigue life by absorbing much of the thermal mismatch between the ceramic package and the printed circuit board (PWB).
With the introduction of CCGA packages, new challenges and adjustments in design and assembly processes must be addressed. For high reliability applications, these adjustments must be made with caution to avoid creating the potential for long term reliability issues and latent field defects. Successful integration of CCGA packages into Circuit Card Assemblies (CCA’s) requires cooperation across all disciplines including Reliability, PWB Design, and Manufacturing Engineering.
Topics discussed in this paper include Finite Element Analysis (FEA) modeling, PWB design, solder stencil design, and manufacturing inspection criteria. The target audiences for this paper are those that are involved in PWB design and assembly specific to high reliability electronic circuit card assembly. The intent of this paper is to provide specific CCGA guidance to companies that design and/or assemble high performance electronics for applications such as Aerospace and Defense.
Ceramic Column Grid Array, CCGA, IPC-7095, IPC-7351, IPC-7525, IPC-610, J-STD-001, Space Addendum, High Reliability Electronics, Space Electronics
Members download articles for free:
Not a member yet?