Assembly and Failure Analysis of WLP with 0.3 mm Pitch and SmallerAuthors: Dudi Amir and Chonglun Fan
Company: Intel Corporation
Date Published: 9/28/2014 Conference: SMTA International
The focus of this paper is on the assembly process of 0.3 mm and 0.260 mm pitch wafer level packages. This paper will describe the test vehicle used and the process characterization, material selection and inspection for successful assembly of the packages on a board similar to a product. It will also provide a process envelope addressing paste printing and flux dipping. Finally, it will discuss common failure modes during SMT and failure analysis methods for the packages.
0.3 mm Pitch, WLP
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