Surface Mount International Conference Proceedings


Author: Brian Coll
Company: Manufacturers’ Services Ltd.
Date Published: 8/23/1998   Conference: Surface Mount International

Abstract: As customers demand higher yields, lower defect rates, and reduced costs, manufacturers face the burden of constantly improving the manufacturing process. Achieving ‘world-class’ quality can be a lasting differentiator in an industry known for commodity pricing and fast-shifting loyalties. Key components of this strategy are process redesign and change management programs aimed at streamlining new product introductions, improving manufacturing processes and building teams dedicated to continuous improvement and the enhancement of individual skills.

This paper defines the critical elements of a global Continuous Process Improvement program. It identifies the key elements of the program, including: establishing benchmarks for world-class performance metrics, standardized metrics, and the migration from data collection to control charting to process capability studies for all key operations. It will also offer guidance on developing models based on statistical measurements, such as Cp/Cpk and Defects per Million Opportunities (DPMO), that will enable manufacturers to better understand processes and subsequently drive improvement both at the design and manufacturing levels.

“You cannot fix what you cannot measure” is one piece of advice that many PCB manufacturers should not ignore.

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