SMTA International Conference Proceedings


Author: Kazuaki Ano
Company: Texas Instruments Japan
Date Published: 9/12/1999   Conference: SMTA International

Abstract: CSP(Chip Scale Package) has driven miniaturization of IC package and its strong demand is continuously increasing. Prime driver of the miniaturization is wireless phones and the records of weight and size are being updated every quarter. This means the development cycle time is incredibly accelerated thus readiness of 0.5mm pitch CSP, which promotes more attractive functions or features but it keeps the size small, is not allowed to take long to support the new model timely.

Popularization of 0.5mm pitch CSP is supposed to be after the year 2000. However, recently standardized W-CDMA(Wide band, Code Division Multiple Access) which uses for wireless phone looks to pull the popularization ahead due to the complex protocol. In this situation, we studied the reliability of 0.5mm pitch T-CSP (Tape-CSP) which used mono-metal layer flexible substrate. This paper will discuss the study of board level temperature cycling performance in terms of the substrate design and the solder ball .

Keywords: T-CSP, FBGA, 0.5mm pitch, BLR

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