THE RELIABILITY IMPROVEMENT OF 0.5MM PITCH T-CSPAuthor: Kazuaki Ano
Company: Texas Instruments Japan
Date Published: 9/12/1999 Conference: SMTA International
Popularization of 0.5mm pitch CSP is supposed to be after the year 2000. However, recently standardized W-CDMA(Wide band, Code Division Multiple Access) which uses for wireless phone looks to pull the popularization ahead due to the complex protocol. In this situation, we studied the reliability of 0.5mm pitch T-CSP (Tape-CSP) which used mono-metal layer flexible substrate. This paper will discuss the study of board level temperature cycling performance in terms of the substrate design and the solder ball .
Keywords: T-CSP, FBGA, 0.5mm pitch, BLR
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