Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb SolderAuthors: P. T. Vianco, J. A. Rejent, A. C. Kilgo, and S. E. Garrett
Company: Sandia National Laboratories
Date Published: 9/28/2014 Conference: SMTA International
Inner pads (near to the stagnation point): 0.31 ± 0.04 microns/s
Outer pads (distant from the stagnation point: 0.53 ± 0.04 microns/s
There were no indications of pad lifting. The appearance of the remnant solder film did not provide an indication of the degree of Cu pad loss underneath it, including any dewetting caused by the local loss of entire pad thickness. This study provides important insight into the dissolution behavior of flowing molten solder as a critical consideration towards the development of a successful assembly process.
Copper dissolution, molten solder, fluid flow
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