SMTA International Conference Proceedings

The Effects of Stencil Alloy, Tension and Cut Quality on Solder Paste Print Performance

Authors: Chrys Shea and Ray Whittier
Company: Shea Engineering Services and Vicor Corporation
Date Published: 9/28/2014   Conference: SMTA International

Abstract: The stencil is a key factor in the solder paste printing process, and many characteristics influence its performance.

This study uses a designed experiment to vary two key stencil characteristics: alloy and cut quality. The experimental matrix directly compares the current best-in-class stainless steel alloy with a new experimental foil material designed for higher tension. Cut qualities are naturally varied by producing the stencils at six different suppliers in each of three global regions, creating a total of twelve individual test specimens.

The tests use a common, very high density production PCB as a test vehicle. Identical print performance experiments are performed. Response variables include print yields, transfer efficiencies and volume repeatabilities using the established ten-print test method. Performance results are compared with the current production process of record.

Key Words: 

Stencil Printing, stencil foil materials, stencil quality

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819