The Effects of Stencil Alloy, Tension and Cut Quality on Solder Paste Print PerformanceAuthors: Chrys Shea and Ray Whittier
Company: Shea Engineering Services and Vicor Corporation
Date Published: 9/28/2014 Conference: SMTA International
This study uses a designed experiment to vary two key stencil characteristics: alloy and cut quality. The experimental matrix directly compares the current best-in-class stainless steel alloy with a new experimental foil material designed for higher tension. Cut qualities are naturally varied by producing the stencils at six different suppliers in each of three global regions, creating a total of twelve individual test specimens.
The tests use a common, very high density production PCB as a test vehicle. Identical print performance experiments are performed. Response variables include print yields, transfer efficiencies and volume repeatabilities using the established ten-print test method. Performance results are compared with the current production process of record.
Stencil Printing, stencil foil materials, stencil quality
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