SMTA International Conference Proceedings


The Effects of Stencil Alloy, Tension and Cut Quality on Solder Paste Print Performance

Authors: Chrys Shea and Ray Whittier
Company: Shea Engineering Services and Vicor Corporation
Date Published: 9/28/2014   Conference: SMTA International


Abstract: The stencil is a key factor in the solder paste printing process, and many characteristics influence its performance.

This study uses a designed experiment to vary two key stencil characteristics: alloy and cut quality. The experimental matrix directly compares the current best-in-class stainless steel alloy with a new experimental foil material designed for higher tension. Cut qualities are naturally varied by producing the stencils at six different suppliers in each of three global regions, creating a total of twelve individual test specimens.

The tests use a common, very high density production PCB as a test vehicle. Identical print performance experiments are performed. Response variables include print yields, transfer efficiencies and volume repeatabilities using the established ten-print test method. Performance results are compared with the current production process of record.

Key Words: 

Stencil Printing, stencil foil materials, stencil quality



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