Quantifying the Improvements in the Solder Paste Printing Process from Stencil Nanocoatings and Engineered Under Wipe SolventsAuthors: Chrys Shea, Mike Bixenman, Debbie Carboni, Brook Sandy-Smith, Greg Wade, Ray Whittier, Joe Perault, and Eric Hanson
Company: Shea Engineering Services, Kyzen Corporation, Indium Corporation, Vicor Corporation, Parmi, and Aculon
Date Published: 5/13/2014 Conference: ICSR (Soldering and Reliability)
This paper and presentation outlines a series of tests performed at three different sites to understand the SPI measurement processes and algorithms, and suggests inspection parameters to better capture and quantify the correlation between nanocoatings and solvent under wipes with overall print quality and process performance.
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