Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder PastesAuthor: Edward Briggs
Company: Indium Corporation
Date Published: 5/13/2014 Conference: ICSR (Soldering and Reliability)
The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created several challenges. Two in particular are obtaining consistent volume in the printed solder paste deposit and minimizing the oxidation of the solder powder in the small deposit during reflow. Solder pastes comprised of finer particle solder powders may help with stencil printing, but the increased surface oxide associated with finer powders may also reduce the reflow process window. The focus of this paper is to provide a statistical comparison of the transfer efficiency of different solder powder particle sizes, specifically types 3, 4, 5, and 6, and to visually observe post reflow results in both optimal and harsh conditions.
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