Rinsing Study to Determine Process Factors for Removing Cleaning Agent from Bottom TerminationsAuthors: David Lober, Mike Bixenman, Ph.D., Ram Wissel & Jason Chan
Company: Kyzen Corporation
Date Published: 5/13/2014 Conference: ICSR (Soldering and Reliability)
One major cleaning challenge is successfully cleaning and rinsing under bottom terminated components. Because of the demands placed on modern printed circuits, including increased component density and circuit complexity, cleaning proves especially critical to ensure proper reliability. This study examines the interplay between cleaning agent and number of rinse cycles on the resistivity of the rinse water, the ionic contamination on the board, and the relative amount of organic residue present in the rinse water and entrapped under bottom terminated components. By understanding the nature of these interactions, the ability of different cleaning agents to be rinsed and the optimum rinsing protocol for aqueous cleaning agents can be determined.
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