ICSR (Soldering and Reliability) Conference Proceedings


Rinsing Study to Determine Process Factors for Removing Cleaning Agent from Bottom Terminations

Authors: David Lober, Mike Bixenman, Ph.D., Ram Wissel & Jason Chan
Company: Kyzen Corporation
Date Published: 5/13/2014   Conference: ICSR (Soldering and Reliability)


Abstract: Rinsing is typically the final stage in an electronics assembly cleaning process. Although it is an integral step, individuals often fail to give rinsing the attention it warrants. If this step is not successfully executed, both the cleaning agent and the residues it has removed will dry on the printed circuit and become redeposited, resulting in a contamination level that may be higher than that found prior to cleaning. Although failing to rinse satisfactorily is problematic, so too is excessive rinsing, as over rinsing proves costly due to the increase in water consumption, wasted time, increased energy consumption, and, in regions where rinse water is not allowed to go to drain, increased disposal costs. Thus, optimizing the rinsing stage of the cleaning process is of primary importance.

One major cleaning challenge is successfully cleaning and rinsing under bottom terminated components. Because of the demands placed on modern printed circuits, including increased component density and circuit complexity, cleaning proves especially critical to ensure proper reliability. This study examines the interplay between cleaning agent and number of rinse cycles on the resistivity of the rinse water, the ionic contamination on the board, and the relative amount of organic residue present in the rinse water and entrapped under bottom terminated components. By understanding the nature of these interactions, the ability of different cleaning agents to be rinsed and the optimum rinsing protocol for aqueous cleaning agents can be determined.

Key Words: 

Cleaning, BTCs



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