Surface Mount International Conference Proceedings


Thermal and Power Cycling Limits of Plastic Ball Grid-Array (PBGA) Assemblies

Authors: Robert Darveaux and Andrew Mawer
Company: Motorola Semiconductor Products
Date Published: 8/23/1995   Conference: Surface Mount International


Abstract: Factors affecting Plastic Ball Grid Array (PBGA) solder joint reliability were investigated using thermal cycling tests and [mite element simulations. Fatigue life can be improved significantly by increasing substrate thickness or pad diameter. Moderate improvements can be achieved by reducing die attach adhesive modulus or die thickness, or by increasing joint height. Combining these design modifications results in reliable assemblies for almost any application. In thermal cycling tests, fatigue life will decrease if the ramp rate or the dwell time is increased. Power cycling life is predicted to be 5x that of thermal cycling under some temperature profile conditions



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