Disruptive Innovation Pulls Manufacturing Out of the BoxAuthors: Herbert J. Neuhaus, Ph.D. and Charles, E. Bauer, Ph.D.
Company: TechLead Corporation
Date Published: 2/11/2014 Conference: Pan Pacific Symposium
This paper analyzes two examples of disruptive innovations stimulating out-of-the-box thinking in electronics packaging. In the first case, Tektronix realized that stationary equipment created an artificial sensitivity to product change-over. In short, the machine that took the most time to reprogram, the wire-bonder, idled the entire manufacturing line during product change-overs. Making the wire-bonders portable (by adding wheels) enabled a substantial increase in productivity with reduced capital investment because the manufacturing line no longer waited for wire-bonder reconfiguration.
In the second example, the authors analyze how embedded chip packaging disrupts the existing value chain. Embedded packaging technologies re-order the conventional flow of operations. Logistics disruptions, significantly limited rework, and yield management concerns force a completely new manufacturing model. For example, who in the value chain absorbs the cost of devices in assemblies with defective interconnects built over the device?
Finally, the authors show how new manufacturing roles and responsibilities can effectively address the challenges of disruptive innovations.
Disruptive Innovation, Embedded packaging, supply chain restructuring
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