Pan Pacific Symposium Conference Proceedings


Power Conversion Trends That Will Impact System Packaging and Assembly

Author: Carl Blake
Company: PSMA, CBK Consulting, Transphorm
Date Published: 2/11/2014   Conference: Pan Pacific Symposium


Abstract: Every two years, The Power Sources Manufacturers Association (PSMA) publishes a Power Technology Roadmap[1] of the Trends that are driving the industry. These trends are tracked from initial viability through mass adoption to determine the impact on system performance. The Roadmap is compiled by bringing together technology, applications and industry business leaders who review the trends, evaluate the impact upon specific industry segments and then predict how that will change future systems.

During the previous 40 years the demand for smaller size and higher efficiency systems has been the motivation for change. Early detection of emerging trends along with independent analysis has provided the industry with valuable insight to adapt new trends or fund studies to minimize the negative consequences of premature adoption. At the present time three trends are having the greatest impact on system performance, these are the proliferation of digital control, introduction of new Compoundsemiconductors such as Gallium Nitride (GaN) and 3-D packaging. Each of these will impact how power conversion systems are assembled and manufactured for the next 10 years.

This paper will discuss how these trends will impact the assembly processes of the future.

Key Words: 

GaN, 3-D packaging, power conversion trends



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