Pan Pacific Symposium Conference Proceedings

The Future of Organic and Printed Electronics: OE-A Roadmap

Authors: Wolfgang Clemens, Donald Lupo, Mark Verrall, Klaus Hecker and Sven Breitung
Company: PolyIC GmbH & Co. KG, Tampere University of Technology, Merck Chemicals Ltd., and OE-A
Date Published: 2/11/2014   Conference: Pan Pacific Symposium

Abstract: Within the OE-A (Organic and Printed Electronics Association) one of the key activities is to produce and regularly update a comprehensive Roadmap for the highest potential applications in printed, flexible and organic electronics. The content of this Roadmap is based on the expert knowledge and contributions from the >200 member organisations in over 30 countries worldwide, representing the entire value chain from earliest research through to end user applications.

The most recent OE-A Roadmap (5th Ed, 2013) identifies and evaluates 5 major application clusters for organic and printed electronics:

  • Organic Photovoltaics
  • Flexible Displays
  • OLED Lighting
  • Electronics and Components
  • Integrated Smart Systems.

    Within each of these clusters, we have identified numerous specific applications, quantified major technical parameters for success, and predicted essential progress of each technology in the short, medium and longer term. Potential challenges or major hurdles (so-called Red Brick Walls) are also identified and discussed, helping to focus developments within the field on the most critical topics.

    A brief overview is given here for the OE-A Roadmap results in each of the application clusters, from existing state-of-the-art through to predictions beyond 2021. The result is a wide-reaching and comprehensive view into the future of this exciting and highly dynamic field of multifunctional printed electronic products, including rollable displays, flexible and lightweight solar cells, disposable diagnostic devices and intelligent packaging, to name just a few.

  • Key Words: 

    Organic electronics, printed electronics, OLED, OPV, displays, sensors, smart packaging, roadmap

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