Pan Pacific Symposium Conference Proceedings

Optimization of Leveler Concentration to Minimize the Contamination of Copper in Via Filling

Authors: Ki-Tae Kim and Jae-Ho Lee
Company: Hongik University
Date Published: 2/11/2014   Conference: Pan Pacific Symposium

Abstract: Electroplating copper via filling is one the most important technology in stacking interconnection of SiP. The requirement for success of via filling is its ability to fill via holes completely without producing voids and seams. Defect free via filling was obtained optimized plating conditions such as current mode, current density and additives. However, by products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this study, the characterization of levelers (JGB, MV, DB) on the copper via filling was investigated without the addition of other additives to minimize the contamination of copper via. Prior to via filling, levelers are analyzed by cyclic voltammetry, galvanostatic & potentiostat plots. The aspect ratio of via is important as well as the size of via. Different aspect ratio and different size of via gave the different optimized conditions. The cross sectional and surface morphologies of via were examined using FESEM.

Key Words: 

via filling, copper electroplating, leveler

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819