Thin Wafer Processing for 3D Integration: Status and UpdateAuthors: Markus Wimplinger, Jürgen Burggraf, Harald Wiesbauer, Thomas Uhrmann, Thorsten Matthias, Garrett Oakes, and Masaya Kawano
Company: EV Group
Date Published: 2/11/2014 Conference: Pan Pacific Symposium
The first part of this paper reviews the recent history of thin wafer processing solutions and issues seen with different process technology and material options. Based on that technological background, an analysis is attempted aimed at explaining the user experience related to temporary bonding/debonding solutions and the perception that is resulting from the collective experiences. The second part of the paper focuses on the current state of thin wafer handling solutions from a technical perspective, supply chain aspects and technological trends observed today.
Finally, the paper concludes with reporting latest achievements in equipment and process technology development aimed at addressing some of the key deficiencies hindering implementation of the technology in high volume manufacturing (HVM). This is illustrated by a review of advances made with respect to in-line metrology solutions aimed at monitoring key quality aspects of temporary bonding / debonding process solutions. Furthermore, novel material solutions schemes are presented and reviewed as well as latest advances related to equipment throughput, cost of ownership and process performance.
Temporary Bonding, Debonding, in-line metrology, crosslinking adhesive, thermoplastic adhesive, mechanical debonding, laser debonding
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