Surface Mount International Conference Proceedings


NO-UNDERFILL FLIP-CHIP ENCAPSULATION

Author: M. Albert Capote
Company: Aguila Technologies
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: We report on a multilayer approach to flip chip assembly that eliminates the need for post-reflow underfilling. It involves new polymeric fluxes that crosslink during reflow and can be pre-applied to the chip at assembly. The encapsulant also involves a laminated film that is adhered to the wafer before dicing. When these polymer fluxes and laminated filtns are used in flip chips, a robust assembly can be created without the need to underIi11. The assembly techniques and progress tnade to date are reported, Keywords: Flip chip, flux, reflow, assembly, untderfill. polqtmer, encapsulant, solder bump



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