Pan Pacific Symposium Conference Proceedings


Advanced Technologies & Materials for Packaging of Power Electronic Modules

Authors: Anton Miric, M. Sc.
Company: Heraeus Materials Technology GmbH and Co. KG
Date Published: 2/11/2014   Conference: Pan Pacific Symposium


Abstract: Standard packaging interconnect materials today are Snbased soft solders (e.g. SnAg or SnAgCu) and aluminium bonding wires.

The continuous reduction of the active chip mass and consequent increase of power density & junction temperatures drive the need for interconnect materials with improved reliability. This is reinforced by the use of wide band gap chip materials, e.g. SiC, GaN which enable even lower losses and even smaller chips.

This reinforces the use of materials with improved thermal/electrical conductivity & higher melting temperature, e.g. Ag and Cu (vs. Aluminum).

This paper discusses several new interconnect materials: Sintering Technology, Diffusion Soldering, AlCu and Cu Wire Bonding. The functional surfaces of interconnect layers, e.g. on the substrate/lead frame will be discussed as well - for best reliability the interconnect material and the interface layers must be perfectly matched together.

Key Words: 

Advanced interconnects, Sintering, Diffusion Soldering, Cu Bonding, Functional Surfaces



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