Pan Pacific Symposium Conference Proceedings


Compact Thermal Models for Virtual Prototyping of Electronic Assemblies: Past, Present & Future

Author: J.H.J. Janssen
Company: NXP Semiconductors
Date Published: 2/11/2014   Conference: Pan Pacific Symposium


Abstract: Compact Thermal Models (CTMs) are now in use for more than 10 years. We have come a long way since the first introduction of the CTMs half way the nineties [1] [2]. This paper will give an overview of problems that still existed from the moment CTMs were introduced, how they were solved, and what must be done to make better use of this technology.

Key Words: 

Compact Thermal Models, cooling of electronics



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