Pan Pacific Symposium Conference Proceedings


Virtual Prototyping for Power Electronics Packaging - Current Status and Future Challenges

Author: Chris Bailey
Company: University of Greenwich
Date Published: 2/11/2014   Conference: Pan Pacific Symposium


Abstract: This paper details current status of modelling for power electronics modules and details the challenges in terms of electrical, thermal, reliability and robustness analysis. Multidomain, multi-physics and multi-objective optimisation toolsets are urgently required for future integrated power electronics. The paper illustrates future trends in power module designs and provides examples of current modelling toolsets and developments in multi-domain (physics) analysis and optimization.

Key Words: 

Power Electronics, Thermal Management, Reliability



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819