Surface Mount International Conference Proceedings


Author: Milton L. Buschbom
Company: Texas Instruments
Date Published: 8/23/1998   Conference: Surface Mount International

Abstract: A continuing rise in the requirement for thermal power dissipation in semiconductor components due to circuit operation at higher frequencies, higher circuit gate counts per unit area, and the increased emphasis in smaller package sizes for portable and hand-held end equipment has created significant challenges to low cost plastic packages. PowerPADTM thermally enhanced package solutions patented by Texas Instruments, provide a cost efficient method of improving traditional plastic package heat transfer from the semiconductor device junction to the printed circuit board (PCB) or system level thermal management system when compared to conventional heat spreader, heat slug, or metal package body options. The improvement in thermal efficiency is accomplished with minimal impact on PCB design construction, or component attachment processes. This paper describes methods used for PowerPADTM implementation in SSOP, TSSOP, MSOP, LQFP, and TQFP semiconductor package styles as examples of the general application of the technique for thermal removal. Design considerations for the implementation of the PowerPADTM solution to plastic semiconductor packages, PCB design recommendations, measured and modeled results obtained for the packages, PCB board assembly. and component re-work guidelines are addressed. PowerPADTM is a trademark of Texas Instruments, Incorporated

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