Pan Pacific Symposium Conference Proceedings


Fault Injectionand Simulation of the Solder Joint Mechanical Creep in Integrated Circuit

Authors: Hu Weiwei, Ph.D., Meng Xiangkun, Sun Yufeng, Zhao Guangyan
Company: Beihang University
Date Published: 2/11/2014   Conference: Pan Pacific Symposium


Abstract: In electronic packaging, mechanical properties failure of solder joints is one of the main reasons that make the electronic product reliability reduce, while the mechanical creep is one of the key factors. Now people's research mostly focus on the mechanical creep properties of the solder joint material and the modification of the classical creep equation in different experimental conditions, but the separate research of solder joints mechanical creep is difficult to provide the basis for circuit fault diagnosis.

In order to solve this problem,a new method which combines fault injection of failure mechanism and circuit simulation has been put forward in this paper.We firstly select the appropriate physics of failuremodels on solder joints mechanical creep. Then we set up a reverse scaling circuitby classic amplifier LM741 and conduct the fault injection of failure mechanism in Pspice. After finishing these, we conduct circuit simulation. For the phenomenon that the output value of nodes changes not much when solder joint mechanical creep occurs, we find the most sensitive node by computing the cumulative change rateand research the change rule of the node specifically. The progress can reflect how the output value of the measurable nodes change with the solder joint mechanical creep development, and provide the basis for circuit fault diagnosis.

Key Words: 

Solder joint, Failure model, Fault injection, Circuit simulation



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