Microelectronic Interposers: From R&D To ManufacturingAuthors: Rao Tummala, Brett Sawyer, Chandrasekharan Nair, Vijay Sukumaran, Yuya Suzuki, Hao Lu and Venky Sundaram
Company: 3D Systems Packaging Research Center (PRC) Georgia Institute of Technology
Date Published: 2/11/2014 Conference: Pan Pacific Symposium
Inorganic packages such as glass or silicon address these fundamental problems and can form the basis of system scaling but they have their own set of technical and financial challenges. These can be combined appropriately and selectively with ultra-thin and special polymers as dielectrics, liners and stress-relief members. But these require electrical, mechanical and thermal co-designs, as well as material and process technologies to form the interposer substrates and interconnections. Most importantly, however, inorganic packages require manufacturing infrastructure.
Glass interposer, TGV formation, Ultrafine/multilayered RDL, interposer substrates and interconnections
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