Pan Pacific Symposium Conference Proceedings

Microelectronic Interposers: From R&D To Manufacturing

Authors: Rao Tummala, Brett Sawyer, Chandrasekharan Nair, Vijay Sukumaran, Yuya Suzuki, Hao Lu and Venky Sundaram
Company: 3D Systems Packaging Research Center (PRC) Georgia Institute of Technology
Date Published: 2/11/2014   Conference: Pan Pacific Symposium

Abstract: Transistor scaling, starting with the invention of the transistor in the 1940s, made electronics the largest global industry, serving a variety of individual industries that span computing, communications, consumer, automotive and others. A new industry that integrates all these into so-called Smart Mobile Systems promises to be the next frontier in electronics hardware, performing every imaginable function in smallest size and lowest cost that every global person could afford. Such revolutionary systems, however, require revolutionary technologies referred to as "system scaling," to go with transistor scaling during the last 60 years. Current hardware approaches, based on organic laminates, have five main limitations, thus not lending themselves as the basis for system scaling: 1) lithographic ground rules, 2) thermal performance, 3) thermal mismatch in TCE- and moisturedriven reliabilities, 4) warpage, as these are processed as ultra-thin and large packages and 5) ionic-migration reliability at small pitch.

Inorganic packages such as glass or silicon address these fundamental problems and can form the basis of system scaling but they have their own set of technical and financial challenges. These can be combined appropriately and selectively with ultra-thin and special polymers as dielectrics, liners and stress-relief members. But these require electrical, mechanical and thermal co-designs, as well as material and process technologies to form the interposer substrates and interconnections. Most importantly, however, inorganic packages require manufacturing infrastructure.

Key Words: 

Glass interposer, TGV formation, Ultrafine/multilayered RDL, interposer substrates and interconnections

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