Surface Mount International Conference Proceedings

European Trends in Reflow Soldering Technology

Author: Robert V. Burress
Company: SEHOUSA,
Date Published: 8/23/1998   Conference: Surface Mount International

Abstract: The worldwide Electronics Assembly Industry has been, and continues to be, a vigorously growing segment of the world economy. As such, the assembly industry has permeated most regions of the world, along with its associated support industries. Although the fundamental concepts of electronic assembly prevail throughout the world, it is interesting to note the subtle differences between manufacturing practices and philosophies. The selection of a no-clean process over a significantly different process, such as water soluble flux soldering followed by aqueous cleaning, can sometimes be attributed to political and/or economic factors prevalent in a particular part of the world, or a specific region within a country. In addition, innovations in technology, with eventual worldwide impact, may occur anywhere on the globe. As an example, nitrogen-inerted wave soldering, now common in manufacturing operations worldwide, had its inception in Europe [1]. Another example is the practical application of microvia technology in Asia resulting in powerful, compact consumer electronics. The following paper attempts to provide insight into recent developments and current trends in European reflow soldering technology.

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