IWLPC (Wafer-Level Packaging) Conference Proceedings


Converging Front-End, Back-End And Flat Panel Display Manufacturing Technologies To Meet 2.5/3D And Fan-Out Packaging Requirements

Authors: Klaus Ruhmer, Rajiv Roy, Philippe Cochet, Elvino Da Silveira
Company: Rudolph Technologies, Inc.
Date Published: 11/5/2013   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The trend towards ever thinner, smaller, higher integrated and more capable devices is driving new advanced packaging and integration technologies such as multi-chip systems on interposer (2.5D), stacked chips (3D) or very thin fan-out packages on reconstituted wafers and panels. These different approaches have significantly altered the requirements for manufacturing tools in the back-end. Techniques and processes which were introduced to frontend manufacturing already several technology generations ago (e.g. 15-20 years ago) are now finding their way into back-end fabs. Despite the fairly demanding requirements, especially as it relates to overall process yield, back-end processes are still expected to demonstrate low Cost of Ownership (COO) at high throughput. For example, a 0.5µm defect inspection would have been considered a front-end requirement 20 years ago. Today TSV and advanced packaging techniques such as fine-pitch RDL are demanding 0.5µm level inspection but at perhaps 10x improvement in wafer throughput and 20x improvement in COO. Similarly, manufacturing techniques from the Flat Panel Display (FPD) industry are playing a key role in the emerging Panel Fan-Out (P-FO) and Glass Interposer space. This paper specifically discusses the differences between established FPD processes and modern advanced packaging needs with a focus on lithography. Other Front-end capabilities ranging from metrology to Advanced Process Control (APC) that are being adopted by the back-end will also be discussed.

Key Words: 

Assembly, Advanced Packaging, Bumping, fine pitch Copper pillar, TSV, 3D Packaging, Stepper, Wafer Inspection, Metrology, Advanced Process Control, 2.5D, Interposer, Panel Fan-Out, WLFO, Wafer Level Fan Out, Glass Interposer, Si Interposer



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