IWLPC (Wafer-Level Packaging) Conference Proceedings


Choosing Lithography Equipment To Minimize The Cost Of Wafer Level Packaging

Authors: Tim McCrone, Robert Hergert; and Ralph Zoberbier
Company: SUSS MicroTec Inc and SUSS MicroTec Lithography GmbH
Date Published: 11/5/2013   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Wafer level packaging carries many advantages for most industries. One of the primary advantages of wafer level packaging is to move away from die level packaging to minimize cost. To minimize the cost of a device, capital equipment must be carefully selected to optimize up time of high performance equipment, such as steppers, and allow more cost effective systems to perform these tasks in the place of steppers where resolution limits allow. Aligners and scanners both require a lower amount of investment than stepper systems, and can achieve resolution required by wafer level packaging to effectively address the needs for most packaging applications. Both machines bring unique advantages to wafer level packaging. Scanning systems produce a shape of light that moves over the substrate, creating an opportunity for unique and sensitive substrate designs to be used. In addition, due to the ability to change the focus of the image, sidewall angle can be precisely controlled. Aligner systems have higher resolution and customizable optics, giving an equipment set up that allows for successful exposure of critical features though source light shaping. Understanding the differences between scanners, aligners, and steppers allows for a better informed choice in the purchase of capital equipment.

Key Words: 

Advanced Packaging, Aligner, Lithography, Exposure, WLP



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