IWLPC (Wafer-Level Packaging) Conference Proceedings


2.5D And 3D Packaging Platform For Next Generation RF And Digital Modules Using Through Glass Vias (TGV) Technology

Authors: Tim Mobley and Sergio Cardona
Company: Triton MicroTechnologies, Inc. and nMode Solutions, Inc.
Date Published: 11/5/2013   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Radio Frequency (RF) communications and demands for instant data drive the need for smaller form factors with high performance and longer battery life. Through Glass Via (TGV) interposers as a packaging platform will allow the integration of higher bandwidth data with a higher degree of reliability when compared to Through Silicon Via (TSV) as a passive interposer. This paper will demonstrate the benefit to processors, microcontrollers, memory and RF front-end sections when using the full advantage of a TGV interposer, as well as provide a roadmap for a disruptive supply chain. TGV technology will improve the methods in which Integrated Circuits (ICs) can be interconnected with superior reliability and achieve the highest performance for 2.5D and 3D packaging.

Key Words: 

Through Glass Via (TGV), 2.5D Packaging, 3D Packaging, Through Silicon Via (TSV), Glass Interposer



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