Novel Cheap Solutions For 3D Integration On Wafers With Thin InterposersAuthors: Semyon D. Savransky, Ph.D.
Company: The TRIZ Experts
Date Published: 11/5/2013 Conference: IWLPC (Wafer-Level Packaging)
3D IC assembly, phase-change alloys, viafree conductors in insulator, wafer-level packaging, facet0- face assembly.
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