IWLPC (Wafer-Level Packaging) Conference Proceedings

Novel Cheap Solutions For 3D Integration On Wafers With Thin Interposers

Authors: Semyon D. Savransky, Ph.D.
Company: The TRIZ Experts
Date Published: 11/5/2013   Conference: IWLPC (Wafer-Level Packaging)

Abstract: It is shown that thin films of phase-change alloy (PCA) might be used for cheap 3D IC assembly on wafers level. Light exposure of PCA creates via-free electrical conductors in insulator.

Key Words: 

3D IC assembly, phase-change alloys, viafree conductors in insulator, wafer-level packaging, facet0- face assembly.

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