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IWLPC (Wafer-Level Packaging) Conference Proceedings
Novel Cheap Solutions For 3D Integration On Wafers With Thin Interposers
Authors: Semyon D. Savransky, Ph.D.Company: The TRIZ Experts
Date Published: 11/5/2013 Conference: IWLPC (Wafer-Level Packaging)
Abstract: It is shown that thin films of phase-change alloy (PCA) might be used for cheap 3D IC assembly on wafers level. Light exposure of PCA creates via-free electrical conductors in insulator.
Key Words:
3D IC assembly, phase-change alloys, viafree conductors in insulator, wafer-level packaging, facet0- face assembly.
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