Advances In 300mm WLCSP Spheron™ Cu Platted RDL Technology For Higher Density And Lower Cost Packaging
Authors: André Cardoso, Anthony Curtis Company: Nanium S.A and FlipChip International Date Published: 11/5/2013
IWLPC (Wafer-Level Packaging)
Abstract: Addressing the market needs for WLCSP on 300mm wafers, Nanium S.A. has successfully transfer Spheron™ Fan-In technology, licensed from FlipChip International, to its 300mm portfolio, where very good uniformity, process capability and reliability have been demonstrated. On the same development path, Nanium S.A. proceeded to the qualification and design of next vehicles, to meet the market trends on ever smaller pitch, higher density and lower cost. A new qualification vehicle, CSP40 on 300mm wafer, aims to demonstrate several features included in technology roadmap for high density packaging, namely: 400um ball pitch, 250um ball size on 12x12 high density BGA; medium size 5.5x5.5mm2 chip; between 300um and 250um die thickness; and 10/10um line/space width lithography for high density routing and future pitch reduction. On the other hand, addressing the multitude of applications and costdriven options, several variants are tested with no-UBM, 1- layer RDL for low-cost devices. This paper describes the results on the CSP40 process on 300mm wafer, namely, demonstrates lithography resolution of Spheron™ Fan-In technology, paving the way for different variants on low-cost design and the outlook for 350um pitch..