Surface Mount International Conference Proceedings


ELECTROMIGRATION STUDIES OF FLIP CHIP BUMP SOLDER JOINTS

Authors: Scott Brandenburg
Company: Delphi Delco Electronics Sys.
Date Published: 8/23/1998   Conference: Surface Mount International


Abstract: This paper describes investigations into the effects of electromigration and thermomigration on flip chip solder bumps. Among the variables studied were bump temperature, bump current, and UBM (under bump metallurgy) geometry. The test assemblies consisted of a standard Delphi Delco Electronics test flip chip fabricated with eutectic Sn-Pb bump metallurgy mounted to FR-4 substrates. To induce electromigration, the assemblies were tested at two steady state DC current levels of 1.25 and 0.625 amps per bump; and two steady state I.C. junction temperature levels of 150C, and 175C. Metallurgical analysis of the solder bump identified metal migration as the primary failure mechanism. An examination of the relationship between flip chip bump life to current density and bump temperature resulted in a mathematical model based upon Black’s equation. Activation energies determined from the data resulted in a model with excellent correlation to actual life data. The model was sufficient to develop design guidelines given inputs of bump operational parameters and environmental conditions.



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