PRECISION PLACEMENI’ CHALLENGES FOR FINE PITCH COMPONENTS
Author: Richard Boulanger Company: Universal Instrurrtents Corp Date Published: 8/23/1998
Surface Mount International
Abstract: This presentation gives an overview of tomorrow’s fine pitch assembly requirements, as well as some imaging and vision requirements and concerns. We also show some alternatives for meeting these needs. General trends require smaller, faster and lighter assemblies with ever increasing levels of functionality. There exist significant price/cost pressures on the entire value chain. Product life cycles are so short that optimized designs are not possible. Many new applications are sprouting for RF and microwave components. The technology transition shown in Figure 1 describes the rapid evolution and explosion of new products over the last 10 years, compared to the frost relatively stable 20 years of insertable components. We will discuss some of these later.