Surface Mount International Conference Proceedings


Author: Brian Blades
Company: Laurier
Date Published: 8/23/1998   Conference: Surface Mount International

Abstract: The development and growth of new methods of packaging die to achieve various goals of size; performance and cost have created new requirements in assembly equipment. These new techniques include bare die attach as well as chip scale packages. Traditionally, bare die have been mostly handled in back end IC assembly and various forms of assembled IC’s were handled at the circuit assembly level. The new techniques have modified or eliminated the traditional IC packaging steps in their unique applications. The growth of these new techniques is starting to influence assembly equipment specifications. These changes are influencing circuit assembly areas. The products, which must be handled, are smaller and more delicate. The environments have to be cleaner because of the nature of the products being handled. Positioning of the placed product becomes more critical as the area between connections becomes smaller. The methods of bonding vary with different requirements for pressure and time during placement. There are issues related to product yield on wafers and different optical requirements for bare die assembly. There are also varied techniques for handling multiple products in one assembly operation. All of these technical changes pose new challenges to the surface mount circuit assembly area. Different handling techniques, the related requirements and results are reviewed. The techniques of die in tape, die in chip trays, die directly from wafer, the required equipment for these techniques, the constraints on each technique, and the costs of ownership are compared.

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