IWLPC (Wafer-Level Packaging) Conference Proceedings


Study Of The Electroless Plating Process For Special Materials Or Small Pads For UBM Formation

Authors: Shigeo Hashimoto, Yukinori Oda, Shinji Ishimaru, Hiromu Inagawa; and Don Gudeczauskas
Company: C. Uyemura & Co., Ltd., and Uyemura International Corporation
Date Published: 11/5/2013   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The plating process of UBM formation is important to add solder joint and wire bonding properties for the aluminum alloy electrode on the silicon wafer. We studied the process which Ni film can be deposited uniformity on sputtered or vapor deposited aluminum features, such as it has various crystal orientation. On the other hand, the spikes often occur by a pretreatment process of the aluminum. Therefore we also studied the pretreatment process to reduce the spikes for aluminum.

Key Words: 

aluminum, pretreatment, electroless plating



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