Study Of The Electroless Plating Process For Special Materials Or Small Pads For UBM FormationAuthors: Shigeo Hashimoto, Yukinori Oda, Shinji Ishimaru, Hiromu Inagawa; and Don Gudeczauskas
Company: C. Uyemura & Co., Ltd., and Uyemura International Corporation
Date Published: 11/5/2013 Conference: IWLPC (Wafer-Level Packaging)
aluminum, pretreatment, electroless plating
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