Automating The Design And Layout Of Wafer Level Masks
Author: Steve DiBartolomeo Company: Artwork Conversion Software Date Published: 11/5/2013
IWLPC (Wafer-Level Packaging)
Abstract: As more integrated circuits are packaged as flip chips, the number of designs passing through the redistribution process has greatly increased. The need to quickly and efficiently design a set of full wafer masks to fabricate the redistribution has also increased. In this paper we discuss a number of techniques and software tools we developed in cooperation with a major OSAT that have proven to greatly reduce the mask design time and to also have reduced errors that were introduced before these automation tools were put in place.