IWLPC (Wafer-Level Packaging) Conference Proceedings


Overcoming the Productivity Challenges in Wafer Level Packaging

Authors: Shekar Krishnaswamy and David F. Hanny
Company: Applied Materials, Inc.
Date Published: 11/5/2013   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Wafer level packaging (WLP) processes have long been the focus of research and development. However, the recent and explosive growth in handheld devices such as tablets and smartphones has enabled many of these R&D efforts to find their way into the manufacturing realm. However, as a natural part of its infancy, WLP faces the challenges of multiple technologies, new players in the competitive mix and updated manufacturing processes and equipment.

Solutions to most of these challenges are being addressed largely from an R&D perspective by focusing on materials, product design and process design. Unfortunately, the aspect of manufacturing or factory design has so far been neglected. WLP factories will not resemble the traditional assembly and test factories and will mirror wafer fabs in structure, operations and performance. Consequently, the history and experience from traditional packaging manufacturing methods can no longer be applied. The characteristics, lifecycles and activities in a wafer fab will have to be learned and deployed in WLP environments.

Factory automation technologies are an enabler for such activities and a catalyst to this change. This paper will focus on the different stages of the factory lifecycle, the respective requirements and challenges, and the automation strategies to overcome those challenges.

Key Words: 

wafer level packaging, manufacturing, process, factory, automation technologies



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