SMTA International Conference Proceedings


Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization

Authors: Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto, Steven Rosser, Rabindra Das, and Glen Thomas
Company: Endicott Interconnect Technologies
Date Published: 10/13/2013   Conference: SMTA International


Abstract: High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic.

This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.

Key Words: 

organic substrates, mechanics of materials, chip-package interaction, flip chip, low loss.



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