Advanced Organic Substrate Technologies to Enable Extreme Electronics MiniaturizationAuthors: Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto, Steven Rosser, Rabindra Das, and Glen Thomas
Company: Endicott Interconnect Technologies
Date Published: 10/13/2013 Conference: SMTA International
This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.
organic substrates, mechanics of materials, chip-package interaction, flip chip, low loss.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.