Manufacturability Assessment Of Next-Generation PCB Surface FinishesAuthors: Sue Teng, J. Oliver and Scott Priore
Company: Cisco Systems, Inc.
Date Published: 10/13/2013 Conference: SMTA International
This investigation, therefore, is focused on evaluating alternative surface finish materials for printed circuit assemblies which are either electrically conductive or can otherwise eliminate the need to print solder on test points. The initial evaluation considers the following surface finish materials: • Pb-free Hot Air Solder Level (HASL) • Immersion Ag • Next-generation surface finish A (NG-A) • Next-generation surface finish B (NG-B)
Each of these surface finishes is evaluated with respect to Pb-free assembly feasibility, including SMT, wavesolder and press-fit processes, in addition to the material robustness, manufacturing variability and post-assembly and post-aging material integrity. The details of this study are discussed in this paper and the results will be used to provide a comparative assessment of the surface finishes.
Additionally, based on the findings from this study, a more in-depth evaluation of the material robustness, performance and reliability from a PCB fabrication, design and systemlevel perspective addressing electrical, mechanical, test and environmental concerns is discussed as future work to be pursued.
surface finish, Pb-free, OSP, Pb-free HASL, Im Ag, ICT, SMT, wavesolder, press-fit
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