SMTA International Conference Proceedings

Characteristics Of EPIG Deposits For Fine Line Applications

Authors: Shigeo Hashimoto, Katsuhisa Tanabe, Masayuki Kiso, Kota Kitajima, Tatsushi Someya, and Don Gudeczauskas and George Milad
Company: C. Uyemura & Corporation Co., Ltd. Central Research Laboratory and UIC Technical Center
Date Published: 10/13/2013   Conference: SMTA International

Abstract: The ability to plate fine patterns, the solder joint reliability (SJR) and the wire bonding reliability (WBR) of the electroless Pd/Au (EPIG) deposit were compared with the electroless Ni-P/Pd/Au (ENEPIG) deposit.

SJR was evaluated by high speed shear test (HSS) when comparing Sn-3.0Ag-0.5Cu with Sn-1.2Ag-0.5Cu-0.05Ni as the composition of the solder ball. When using Sn-1.2Ag- 0.5Cu-0.05Ni as the solder ball for EPIG film, the uniform alloy layer was formed and SJR became excellent.

EPIG deposits with thicker Pd had good WBR because the Pd layer prevented Cu diffusion to the top of Au surface after heat treatment. And when Au thickness of EPIG deposit was thicker, WBR became better because the ratio of Pd on the top surface was kept lower after heat treatment.

On the other hand, WBR after heat treatment was improved by applying plasma treatment on Au surface.

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