ESD CONSIDERATIONS FOR AUTOMATED HANDLING OF SMT DEVICES
Author: Joe Bernier Company: Harris Serniccmductor Date Published: 8/23/1998
Surface Mount International
Abstract: Electrostatic discharge (ESD) events during handling, testing, and subsystem assembly of surface mounted devices can cause serious yield loss in manufacturing, from the front end assembly operations of the IC manufacturer to backend test, marking, packing, and board and subsystem assembly. In front-end semiconductor assembly areas, ESD damages product directly resulting in lower device yield. In backend processing areas when costly packages have been added to the product, expensive rejects, loss of production time, and lower process units per hour (UPH) can result. At the board and subsystem assembly level, rework due to failed devices can be many times more expensive than first time success. And of course field returns are the most expensive of all failures to remedy. Overall, ESD costs semiconductor manufacturers and users millions of dollars every year, in product yield loss, field returns and cost of prevention.