Is A High Phosphorus Content In The Nickel Layer A Root Cause For “Black Pad” On Enig Finishes?Authors: Dipl.-Ing. Mustafa Özkök, Joe McGurran, and Kenneth Lee, Ph.D.
Company: Atotech Deutschland GmbH, Atotech USA Inc., and Atotech Asia Pacific Ltd.
Date Published: 10/13/2013 Conference: SMTA International
This paper is focusing on one specific question: “Is the phosphorus content of the nickel layer of an ENIG surface finish the root cause for black pad?” This issue is resolved using a purely scientific approach and by showing the related technical data by means of micro sections, solder joint reliability tests and phosphorus content measurements.
The paper will describe and explain the black pad failure mechanism. Furthermore, the paper will submit examples and results of (ENIG) electroless nickel layers with different phosphorus contents, while examining the degree of corrosion. Additionally, results of solder joint reliability tests will be presented that include variations in the amount of thermal exposure.
Black Pad, ENIG, High phosphorus, Mid phosphorus, Low phosphorus.
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