Lead-Free Laminate DMA And Tma Data To Develop Stress Versus Temperature Relationship For Predicting Plated Hole Reliability
Authors: Stephanie Moran, Joseph Smetana Jr., and Michael Freda Company: Oracle and Alcatel Lucent Date Published: 10/13/2013
Abstract: Reliability of plated holes is important when assessing the field life of products. Determining the most accurate and efficient test method for reliability analysis can be a daunting task. In this paper we identified over twenty different lead-free laminate and resin combinations, with a particular focus on low loss laminates for high-speed applications. We used an inverse power law relation of cycles to failure versus stress to predict plated through hole reliability. Stress versus temperature curves were derived from TMA and DMA data in the laminates. Previous work shows good cycle to failure correlation between IST and ATC test methods when their temperature differences are compensated for stress. The new TMA and DMA data is first combined to construct stress versus temperature plots. We will then add the new cycle-to-failure versus stress data from this round of IST testing to data from our earlier leadfree laminate testing.