Author: Vaughan Carlson Company: Acculogic Date Published: 10/13/2013
Abstract: The scenario for testing electronics at the PC Board level changes daily it seems, with new device types, new soldering process, new manufacturing techniques, and new formulas for solder. It’s incumbent on Test Engineers to keep up with these changes to make sure that our electrical test and inspection capabilities will detect faults that occur even in the best of manufacturing facilities. The scenario for test equipment implementation in a typical factory has changed dramatically over the last several years with the advent of breakthroughs in some test equipment, coupled with inspection technologies. The purpose of this Paper is to document these trends and capabilities for the Test Engineers, their managers, and their co-workers. This Paper provides some background information, yet when a Stateof- the-Art technique is discussed, it’s marked with SotA.